C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 59/50 (2006.01) C08J 3/22 (2006.01) C09D 163/00 (2006.01) C09J 163/00 (2006.01)
Patent
CA 2625794
A microencapsulated latent hardener for epoxy resins which comprises cores (C) and shells (S) with which the cores are covered, characterized in that the cores (C) are ones formed from, as a starting material, particles of an epoxy resin hardener (H) comprising an amine adduct (A) and a low-molecular amine compound (B) as major ingredients and that the shells (S) have on the surface thereof connecting groups (x), (y), and (z) which absorb infrared. Also provided is an epoxy resin composition containing the hardener.
L~invention concerne un agent de durcissement latent microencapsulé pour résines époxy, comprenant des cAEurs (C) et des enveloppes (S) recouvrant les cAEurs, caractérisé en ce que les cAEurs (C) sont formés à partir d~un matériau de départ constitué de particules d~un agent de durcissement de résine époxy (H) comprenant un adduct aminé (A) et d~un composé aminé de faible masse moléculaire (B) en tant qu'ingrédients principaux, et en ce que les enveloppes (S) comportent à leur surface des groupements connecteurs (x), (y), et (z) absorbant les infrarouges. L~invention concerne également une composition de résine époxy contenant l'agent de durcissement.
Daikai Kazuhiro
Kondo Yoshikimi
Uchida Hiroshi
Asahi Kasei Chemicals Corporation
Goudreau Gage Dubuc
LandOfFree
High-stability microencapsulated hardener for epoxy resin... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High-stability microencapsulated hardener for epoxy resin..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-stability microencapsulated hardener for epoxy resin... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1408547