High-strength solder alloy

Details High-strength solder alloy High-strength solder alloy

B - Operations, Transporting

23

K

B23K 35/26 (2006.01) B23K 35/36 (2006.01)

Patent

CA 2162263

The purpose of the present invention is to propose a high strength solder alloy which has a stronger mechanical strength and an excellent wetness property. The high strength solder alloy according to the present invention is characterized in that it comprises Si of 0.0005 to 0.35 wt.%, Ag of 0 to 5.0 wt.%, Sb of 0 to 10.0 wt.%, Bi of 0 to 10.0 wt.%, Sn of 20 to 95 wt.%, Pb of 0 to 70 wt.% and Ca of 0 to 0.5 wt.%.

Alliage de soudage présentant des résistances mécaniques supérieures et une excellente mouillabilité, comprenant les pourcentages pondéraux suivants: de 0,0005 à 0,35 de Si, de 0 à 5,0 de Ag, de 0 à 10,0 de Sb, de 0 à 10,0 de Bi, de 20 à 95 de Sn, de 0 à 70 de Pb et de 0 à 0,5 de Ca.

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