High temperature baking paste

Details High temperature baking paste High temperature baking paste

H - Electricity

01

B

H01B 1/22 (2006.01) B22F 1/00 (2006.01) B22F 1/02 (2006.01) C22C 9/00 (2006.01) C22C 32/00 (2006.01) H01B 1/02 (2006.01) H01B 1/16 (2006.01) H01C 17/28 (2006.01) H01G 4/005 (2006.01) H05K 1/09 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2058414

A composition, which comprises copper alloy powder represented by a general formula AgxCuyMz (where M represents one or more metals selected from Pb, Bi and Zn; x, y and z are atomic ratio values, respectively; and 0.001 ? x ? 0.4, 0.6 ? y ? 0.999, 0 ? z ? 0.05 and x + y + z = 1) having particle surface silver concentration higher than the average silver concent- ration thereof and a region in which a silver concent- ration increases toward the particle surface, glass frit and an organic vehicle, is useful for pastes for screen printing, electroconductive circuits, electrodes, electromagnetic wave shields and an electroconductive pastes for a resistance contacts.

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