High temperature electronic devices

H - Electricity – 01 – L

Patent

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Details

H01L 23/42 (2006.01) H01L 21/76 (2006.01) H01L 27/02 (2006.01)

Patent

CA 2543909

In at least some embodiments, electronic devices suitable for use at temperatures in excess of 200 ~C may comprise an integrated circuit fabricated on a silicon carbide substrate, and a thick passivation layer. In other embodiments, electronic devices suitable for use at temperatures in excess of 200 ~C may comprise an integrated circuit formed from silicon located on a sapphire substrate, and a thick passivation layer. The electronic devices may be implemented in the context of hydrocarbon drilling and production operations.

Dans au moins certains modes de réalisation, la présente invention a trait à des dispositifs électroniques aptes à être utilisés à des températures dépassant 200 ·C comportant un circuit intégré fabriqué sur un substrat de carbure de silicium, et une couche de passivation épaisse. Dans d'autres modes de réalisation, l'invention a trait à des dispositifs électroniques aptes à être utilisés à des températures dépassant 200 ·C comportant un circuit intégré réalisé en silicium disposé sur un substrat de saphir, et une couche de passivation épaisse. Les dispositifs électroniques peuvent être mis en oeuvre dans le cadre d'opérations de forage et de production d'hydrocarbures.

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