High temperature epoxy adhesive films

Details High temperature epoxy adhesive films High temperature epoxy adhesive films

C - Chemistry, Metallurgy

09

J

C09J 163/00 (2006.01) C08G 59/50 (2006.01) C08K 5/18 (2006.01) C09J 7/04 (2006.01)

Patent

CA 2462454

The invention provides polyepoxide-based adhesives containing cycloaliphatic- containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl- 4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.

L'invention concerne des colles polyépoxydes qui contiennent une résine polyépoxyde cycloaliphatique, une résine polyépoxyde aromatique et 9,9-bis(3-méthyl-4-aminophényl)fluorène. Ces colles sont caractérisées par une résistance améliorée au pelage et au cisaillement.

Affiliated with

Also associated with

Rating

High temperature epoxy adhesive films does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High temperature epoxy adhesive films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature epoxy adhesive films will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1611219