High temperature interconnect system for an integrated circuit

Details High temperature interconnect system for an integrated circuit High temperature interconnect system for an integrated circuit

H - Electricity

01

L

356/134

H01L 23/52 (2006.01) H01L 21/768 (2006.01) H01L 23/532 (2006.01)

Patent

CA 1265258

Abstract A semiconductor integrated circuit device is provided with an electrical interconnect system which is stable at high temperatures. The interconnect system employs refractory metal compounds which are electrically conductive, which form stable couples with silicon and compounds thereof, and which remain stable at temperatures exceeding approximately 500°C.

504211

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