High temperature packer with low temperature setting...

Details High temperature packer with low temperature setting... High temperature packer with low temperature setting...

E - Fixed Constructions

21

B

166/63

E21B 33/12 (2006.01)

Patent

CA 1195242

ABSTRACT This invention relates to packer element design for use in well bores that may be at a relatively low initial temperature and be subsequently heated to much higher temperatures. High temperature packing material of asbes- tos fibers impregnated with Inconel wire is employed in packer rings of frusto-conical shape which face on a center packer ring of triangular cross-section formed of the same material. Low melting point thermoplastic wafers of frusto-conical shape are interspersed at least between adjacent frusto-conical packer rings. These thermoplastic wafers soften at a relatively low well bore temperature and help to initiate a seal when squeezed between the high temperature rings as the packer is set. As the well bore temperature increases, the low melting point thermoplastic liquifies and is squeezed out from between the high temperature packer segments, which then take over the sealing function. -23-

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