High temperature polyamide coating for fasteners

C - Chemistry – Metallurgy – 08 – L

Patent

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Details

C08L 77/02 (2006.01) C08K 3/40 (2006.01) C08K 7/18 (2006.01) C08L 33/10 (2006.01) C08L 63/00 (2006.01) C09D 177/02 (2006.01) F16B 33/06 (2006.01) F16B 39/01 (2006.01) F16B 39/38 (2006.01)

Patent

CA 2643379

A high temperature polyamide coating and a fastener coated with a composition that includes from about 60 wt.% to about 80 wt.% of an aliphatic polyamide having a repeating unit. The composition also includes from about 3 wt.% to about 9 wt.% of an epoxy based resin having a molecular weight in the range from about 525 to about 585, from about 4 wt.% to about 10 wt.% of a ceramic microsphere material and from about 2 wt.% to about 5 wt.% of a thermoplastic methacrylate binder, from about 4 wt.% to about 12 wt.% of crushed glass, from about 0.1 wt.% to about 1 wt.% of a polyamide with a secondary amino group as a curing agent, and the balance of an epoxy based curing agent.

L'invention concerne un revêtement polyamide haute température et une fixation enduite d'une composition contenant environ 60 % en masse à environ 80 % en masse d'un polyamide aliphatique présentant un motif répété. Cette composition contient également environ 3 % en masse à environ 9 % en masse d'une résine à base d'époxy présentant une masse moléculaire comprise entre environ 525 et environ 585, environ 4 % en masse à environ 10 % en masse d'un matériau à microsphères céramiques et environ 2 % en masse à environ 5 % en masse d'un liant méthacrylique thermoplastique, environ 4 % en masse à environ 12 % en masse de verre granulé et environ 0,1 % en masse à environ 1 % en masse d'un polyamide avec un groupe amino secondaire comme agent de cuisson, le solde étant constitué d'un agent de cuisson à base d'époxy.

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