High-temperature powder deposition apparatus and method...

C - Chemistry – Metallurgy – 23 – C

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C23C 24/08 (2006.01) B05B 7/20 (2006.01) B05B 12/08 (2006.01)

Patent

CA 2489577

A deposit is formed on a deposition substrate (52) using a deposition gun (32) that burns a mixture of a fuel and an oxidizer to form a deposition gas flow, mixes a powder into the deposition gas flow to form a deposition mixture flow (44), and projects the deposition mixture flow (44) therefrom. The deposition gun (32) is provided with a flowing coolant. A flow rate of the fuel to the deposition gun (32), a flow rate of the oxidizer to the deposition gun (32), a flow rate of the powder to the deposition gun (32), and a cooling capacity of the coolant flow are all measured. The flow rate of the fuel, the flow rate of the oxidizer, the flow rate of the powder, and the cooling capacity of the coolant flow are all controlled responsive to the step of measurements.

Un dépôt est formé sur un substrat de dépôt (52) au moyen d'un pistolet de dépôt (32), lequel a pour fonction : de brûler un mélange d'un combustible et d'un oxydant pour former un flux de gaz de dépôt, de mélanger une poudre dans le flux de gaz de dépôt, de manière à former un flux de mélange de dépôt (44), et de pulvériser par projection ce flux de mélange de dépôt (44). Le pistolet de dépôt (32) renferme un réfrigérant en écoulement. On mesure, à la fois, le débit de combustible amené au pistolet (32), le débit de poudre alimentant le pistolet (32), et la capacité de refroidissement du circuit réfrigérant. Le débit de combustible, le débit d'oxydant, le débit de la poudre et la capacité de refroidissement du circuit réfrigérant sont tous contrôlés en réponse aux étapes de mesure.

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