B - Operations – Transporting – 32 – B
Patent
B - Operations, Transporting
32
B
B32B 27/08 (2006.01) H05K 3/02 (2006.01)
Patent
CA 2279197
Multilayered films produced by coextending or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original length. Such a high orientation ratio for the multilayered film increases the mechanical strength and toughness properties of the film. The multilayered films are suitable for use as release films for high temperature composite applications such as printed circuit boards.
L'invention concerne des couches minces multicouches, obtenues par co-extrusion ou stratification de couches minces ayant au moins une couche de polyméthylpentène, au moins une couche de polyamide et une couche adhésive intermédiaire en polymère. La couche de polyamide permet d'étirer la couche de polyméthylpentène jusqu'à six fois sa longueur originale. Ce taux d'orientation élevé sur la couche mince multicouche en accroît la résistance mécanique et la ténacité. Lesdites couches minces sont utiles en tant que couches minces à capacité de libération dans des applications composites sous haute température, comme c'est le cas pour les cartes imprimées.
Deantonis Ferdinand A.
Degrassi Alfieri
Tsai Mingliang Lawrence
Alliedsignal Inc.
Gowling Lafleur Henderson Llp
Honeywell International Inc.
LandOfFree
High temperature release films does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High temperature release films, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High temperature release films will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1421154