High temperature release sheet for printed circuit boards

Details High temperature release sheet for printed circuit boards High temperature release sheet for printed circuit boards

B - Operations, Transporting

29

C

400/5802, 400/78

B29C 33/68 (2006.01) B29C 37/00 (2006.01) B30B 15/06 (2006.01) C08J 5/18 (2006.01) C08K 3/00 (2006.01) H05K 3/02 (2006.01)

Patent

CA 1310781

DC-0221 ABSTRACT OF THE DISCLOSURE A process and nylon release sheet for manufacturing printed circuit boards from epoxy prepregs is disclosed. In such process layers of the prepregs are separated from one another by a release sheet. The release sheet comprises an aliphatic or aromatic nylon or nylon copolymer which is a condensation product of a dicarboxylic acid and a diamine. The nylon film contains a heat stabilizer and an inorganic particulate antiblock additive, e.g. diatomaceous earth, glass beads, amorphous silica, talc, mica and molybdenum disulphide. The nylon may be toughened by the addition of a phosphorus- containing catalyst or an epoxide.

582175

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