High temperature stable adhesive composition employing...

Details High temperature stable adhesive composition employing... High temperature stable adhesive composition employing...

C - Chemistry, Metallurgy

07

D

402/221, 400/504

C07D 487/04 (2006.01) C08F 120/30 (2006.01) C08K 5/34 (2006.01) C09J 4/00 (2006.01)

Patent

CA 1251798

ABSTRACT OF THE DISCLOSURE Novel curing compositions are prepared comprising an acrylic or substituted acrylic monomer and a normal polyimide or polyisoimide bisacetylene additive. The monomer is selected from: (i) Image (ii) and mixtures thereof, while the additive has the structure: Image (iii) ; or Image (iv)

471744

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