High-temperature superconductor arrangement, and a method...

H - Electricity – 01 – L

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H01L 39/06 (2006.01) H01L 39/14 (2006.01) H01L 39/16 (2006.01)

Patent

CA 2326059

The present invention relates to a high- temperature superconductor arrangement which is protected against hot spots. A contact-making layer 4 is provided between a superconductor layer 1 and an electrical bypass 2, which contact-making layer 4 has anisotropic electrical conductivity. This ensures a low contact resistance between the superconductor 1 and the bypass 2, without the admittance being increased in the main current flow direction 3. The said anisotropy is produced by discontinuities in the contact-making layer 4, for example by said contact-making layer 4 being broken down into areas 41 which are not connected to one another. Furthermore, a two-stage method is specified for producing an arrangement according to the invention. In this case, firstly, the contact-making layer 4 is applied to the superconductor 1 by means of co-sintering or post-sintering processes, and is then bonded or soldered to the bypass 2 via an intermediate layer 5.

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