High thermal conductivity aluminum nitride ceramic body

Details High thermal conductivity aluminum nitride ceramic body High thermal conductivity aluminum nitride ceramic body

C - Chemistry, Metallurgy

04

B

25/128, 23/223

C04B 35/58 (2006.01)

Patent

CA 1242566

HIGH THERMAL CONDUCTIVITY ALUMINUM NITRIDE CERAMIC BODY ABSTRACT OF THE DISCLOSURE The process comprises forming a mixture comprised of aluminum nitride powder and free carbon wherein the aluminum nitride has a predetermined oxygen content higher than about 0.8% by weight and wherein the amount of free carbon reacts with such oxygen content to produce a deoxidized powder or compact having an oxygen content ranging from greater than about 0.35% by weight to about 1.1% by weight lower than the predetermined oxygen content, heating the mixture or a compact thereof to react the carbon and oxygen producing the deoxidized aluminum nitride, and sintering a compact of the deoxidized aluminum nitride producing a ceramic body having a density greater than 85% of theoretical and a thermal conductivity greater than 0.5 W/cm.K at 22°C.

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