C - Chemistry – Metallurgy – 04 – B
Patent
C - Chemistry, Metallurgy
04
B
261/1, 25/128
C04B 35/58 (2006.01) C04B 35/581 (2006.01)
Patent
CA 1235147
HIGH THERMAL CONDUCTIVITY CERAMIC BODY ABSTRACT OF THE DISCLOSURE A process for producing an aluminum nitride ceramic body having a composition defined and encompassed by polygon PlJFA4 but not including lines JF and A4F of Figure 4, a porosity of less than about 10% by volume, and a thermal conductivity greater than 1.00 W/cm.K at 25°C which comprises forming a mixture comprised of aluminum nitride powder containing oxygen, yttrium oxide, and free carbon, shaping said mixture into a compact, said mixture and said compact having a composition wherein the equivalent % of yttrium and aluminum ranges between points J and A4 of Figure 4, said compact having an equivalent % composition of Y, A1, O and N outside the composition defined and encompassed by polygon PlJFA4 of Figure 4, heating said compact to a temperature at which its pores remain open reacting said free carbon with oxygen contained in said aluminum nitride producing a deoxidized compact, said deoxidized compact having a composition wherein the equivalent % of Al, Y, O and N is defined and encompassed by polygon PlJFA4 but not including lines JF and A4E of Figure 4, and sintering said deoxidized compact at a temperature of at least about 1850°C producing said ceramic body.
496578
Bobik Carl F.
Huseby Irvin C.
Company General Electric
Eckersley Raymond A.
LandOfFree
High thermal conductivity ceramic body does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High thermal conductivity ceramic body, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High thermal conductivity ceramic body will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1272489