High thermal conductivity ceramic body

Details High thermal conductivity ceramic body High thermal conductivity ceramic body

C - Chemistry, Metallurgy

04

B

261/1, 25/128

C04B 35/58 (2006.01) C04B 35/581 (2006.01)

Patent

CA 1235146

HIGH THERMAL CONDUCTIVITY CERAMIC BODY ABSTRACT OF THE DISCLOSURE A process for producing an aluminum nitride ceramic body having a composition defined and encompassed by polygon PINIKJ but not including lines KJ and PIJ of Figure 4, and a thermal conductivity greater than 1.00 W/cm?K at 25°C which comprises forming a mixture comprised of aluminum nitride powder containing oxygen, yttrium oxide, and free carbon, shaping said mixture into a compact, said mixture and said compact having a composition wherein the equivalent % of yttrium and aluminum ranges between points K and Pl of Figure 4, said compact having an equivalent % composition of Y, Al, O and N outside the composition defined and encompas- sed by polygon PINIKJ of Figure 4, heating said compact up to a temperature at which its pores remain open reacting said free carbon with oxygen contained in said aluminum nitride producing a deoxidized compact, said deoxidized compact having a composition wherein the equivalent % of Al, Y, O and N is defined and encompassed by polygon PINIKJ but not including lines KJ and PIJ of Figure 4, and sintering said deoxidized compact at a temperature of at least about 1860°C producing said ceramic body.

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