High thermal conductivity metal matrix composite

C - Chemistry – Metallurgy – 22 – C

Patent

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C22C 1/10 (2006.01) C22C 26/00 (2006.01) H01L 23/373 (2006.01)

Patent

CA 2048005

MFE-P-4571 ABSTRACT OF DISCLOSURE A thermally conductive diamond metal composite comprising 5 to 80 volume percent diamond particles having a particle size ranging from about 1 to 50 µm and a metal matrix comprising a thermally conductive metal. Preferrably, a fine metal powder having particle size below 53 microns is utilized as the source for the metal matrix. MFE:swv PTO.AX9

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