High thermally conductive polymeric adhesive

Details High thermally conductive polymeric adhesive High thermally conductive polymeric adhesive

C - Chemistry, Metallurgy

09

J

400/7005, 400/70

C09J 5/02 (2006.01) C09J 5/08 (2006.01) C09J 9/00 (2006.01) C09J 9/02 (2006.01)

Patent

CA 2283412

A thermosetting adhesive paste exhibiting a high thermal conductivity suitable for die attach applications.

Cette invention se rapporte à une pâte adhésive thermodurcissable présentant une conductivité thermique élevée, adaptée à la fixation de puces.

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