High wet strength waferboard

Details High wet strength waferboard High wet strength waferboard

B - Operations, Transporting

32

B

154/131

B32B 21/02 (2006.01)

Patent

CA 1193182

ABSTRACT OF THE DISCLOSURE A high wet strength waferboard panel is dis- closed made from aspen species of wood flakes or equi- valent with average specific gravity less than 0.6 and having wet strengths equivalent to plywood. At least a portion of the wood wafers are oriented generally in a lengthwise direction such that the length to width strength ratio of the panel, measured as modulus of rupture, is in the range of about 1.3:1 to 2:1, the density of the waferboard panel being in the range of about 38 to 45 lb/ft3, the content of adhesive resin in the panel being in the range of about 4% to 10%, the content of wax in the panel being in the range of about 1% to 2-1/2% and the thickness of the panel being in the range of about 3/8 to 1-1/2 inches. The fully soaked panel having a moisture content of at least about 30% with an MOR lengthwise greater than about 2900 lb/in2 and an MOE lengthwise greater than about 0.9 x 106 lb/in2.

430566

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