Highly concentrated filler slurries

C - Chemistry – Metallurgy – 09 – D

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C09D 7/12 (2006.01) C08K 5/19 (2006.01) C09D 17/00 (2006.01)

Patent

CA 1160401

HOE 80/F 020 Highly concentrated filler slurries Abstract of the Disclosure: Filler slurries with a content of 0.1 to 5 % by weight of a compound of the formula Image (1) in which R is hydrogen or methyl, R1 is C8-C24-alkyl, C8-C24-alkenyl or C8-C24-alkylphenyl, R2 is hydrogen, C1-C4-alkyl, C1-C4-hydroxyalkyl, C2-C4-epoxyalkyl, benzyl or a group of the formula - (CH2?HO)zH, X, Y and Z together are a number from 1 to 20, and A means an anion.

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