Holding device for semiconductor wafers

Details Holding device for semiconductor wafers Holding device for semiconductor wafers

H - Electricity

01

L

H01L 21/68 (2006.01) H01L 21/673 (2006.01)

Patent

CA 2347295

The invention relates to a holding device for semi-conductor disks (wafer), wherein several semi-conducting disks can be inserted parallel to each other, overlapping each other and at a distance from each other and said device comprises several horizontal struts (1) in operating position in which mutually and vertically parallel rings or ring segments (2) are mounted. The upwards pointing surfaces of said rings or ring segments (2), which form support surfaces for said semi-conductor disks, are either polished or provided with support rods (20).

L'invention concerne un support pour disques à semi-conducteurs (plaquettes), dans lequel plusieurs disques à semi-conducteurs peuvent être superposés parallèlement à distance les uns des autres. Ce support comporte plusieurs montants (1) verticaux en position d'utilisation, sur lesquels des anneaux ou des segments annulaires (2) sont superposés parallèlement à distance les uns des autres. Les surfaces des anneaux ou des segments annulaires (2) orientées vers le haut, formant les zones d'appui pour les disques à semi-conducteurs, sont soit polies, soit pourvues de tiges support (20).

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