C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
117/30, 403/66,
C08J 9/00 (2006.01) B01J 13/14 (2006.01) C08J 3/28 (2006.01) C09J 7/02 (2006.01) C09J 9/02 (2006.01) C09J 133/08 (2006.01)
Patent
CA 2032766
Docket Number: 44408CAN9A Abstract Hollow, polymeric, acrylate, infusible, inherently tacky, solvent-insoluble, solvent-dispersible, elastomeric, nitrogen-containing, acid-free pressure- sensitive adhesive microspheres having an average diameter of at least about 1 micrometer wherein a majority of the microspheres contain multiple interior voids, a majority of the voids having a diameter of less than about 10% of the diameter of the microsphere, the total of the diameters of the voids being at least about 10% of the diameter of the microsphere. These hollow microspheres are useful as repositionable pressure-sensitive adhesives. The invention also provides pressure-sensitive adhesives consisting essentially of such acid-free hollow microspheres. Aqueous suspensions of these microspheres, processes for their preparation, spray repositionable pressure-sensitive adhesive compositions, and pressure- sensitive adhesive coated sheet materials are also provided. Surprisingly, hollow microspheres of the invention may be used in combination with delicate substrates such as photographs without causing discoloration or damage, in comparison with prior art repositionable pressure-sensitive adhesives.
Minnesota Mining And Manufacturing Company
Smart & Biggar
LandOfFree
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