Hollow filament bundle for diffusion device

B - Operations – Transporting – 01 – D

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

182/14.1

B01D 63/02 (2006.01) D01D 5/24 (2006.01) D01F 2/04 (2006.01)

Patent

CA 1109000

ABSTRACT OF THE DISCLOSURE This application discloses an apparatus and method for preparing an elongated, coreless bundle of homogeneously distributed hollow, generally longitudinally-directed, semi- permeable filaments, free of direct mechanical attachment to each other, for use as a fluid separation element in a dif- fusion device such as a dialyzer. The filaments are positioned in the bundle whereby the majority of the lengths thereof, and the overall directions thereof, define an angle to the longitudinal axes of the said filament bundle. The filaments are positioned in crossing, overlying relation with adjoining filaments, said filaments essentially occupying individual, parallel, flat planes. The filaments define first sets of generally parallel strands defining a first angular relation to said longitudinal axis and second sets of generally parallel strands defining an opposite angular relation to said longitudinal axis, a first filament of a first set being overlaid by a first filament of a second set, which first filament of said second set is, in turn, overlaid by a second filament of said first set, which second filament of said first set is, in turn, overlaid by a second filament of said second set. The said relationship continues throughout the majority of the filaments of the first and second sets to define interleaving releationships, in which the filaments of each set overly the immediately- preceding filaments of the other associated set, and are overlaid by the immediately-following filaments of said other set, the majority of individual filaments thereof extending across 15 to 50 percent of the width of said filament bundle.

291548

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Hollow filament bundle for diffusion device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hollow filament bundle for diffusion device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hollow filament bundle for diffusion device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-859369

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.