Hollow microspheres with organosilicon-silicate surfaces

B - Operations – Transporting – 29 – D

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B29D 22/00 (2006.01) B01J 13/04 (2006.01) B32B 5/16 (2006.01) C03B 19/10 (2006.01) C03C 11/00 (2006.01) C03C 17/30 (2006.01) C04B 20/10 (2006.01)

Patent

CA 1221586

Abstract of the Disclosure Hollow microspheres of reduced surface energy and reactivity are prepared by simultaneously forming said microspheres and reacting them with an organosilicon compound. The microspheres are prepared by spray drying a solution of alkali metal silicate and a "polysalt." The organosilicon is present as the microspheres are formed and react to form the surfaces of the spheres. The re- sulting product is more discrete, more free-flowing, has better packaging characteristics, improved packing factor and improved filler properties when compared to prior-art microspheres.

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