H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/10
H05K 1/14 (2006.01) H05K 3/42 (2006.01) H05K 3/46 (2006.01) H05K 1/05 (2006.01)
Patent
CA 1149518
-64- HOLLOW MULTILAYER PRINTED WIRING BOARD AND PROCESS FOR MANUFACTURING SAME ABSTRACT OF THE DISCLOSURE A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multi- layer printed wiring board is comprised of a plurality of printed substrates, superposed upon each other with a predetermined space therebetween, each of which substrate has a signal conductor pattern formed on at least one surface thereof and a land conductor pattern formed on at least one surface thereof. Each substrate has plated through holes in the land conductor pattern, each of which holes is in line with another plated through hole of at least one of the neighboring substrates to form a through hole or an interstitial via hole. A layer of a low melting point metal is formed at least on the upper and lower end surfaces of each plated through holes, which layer serves as a through connection between two or more signal conductor patterns of the substrates and as an interlayer adhesion between the substrates. The superposed substrates, except for at least one surface substrate, are made of a thermally resistant organic synthetic resin sheet or an insulation- -treated metal.
352692
Imura Takayoshi
Kurosawa Keiji
Mitsui Hisami
Miyabara Ayako
Miyagawa Kiyotaka
Fujitsu Limited
Mcfadden Fincham
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