Hollow package manufacturing method and apparatus

Details Hollow package manufacturing method and apparatus Hollow package manufacturing method and apparatus

B - Operations, Transporting

65

B

B65B 23/00 (2006.01) B65B 9/00 (2006.01) H01L 21/00 (2006.01) H01L 23/10 (2006.01)

Patent

CA 2201083

A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.

Méthode de fabrication d'un emballage tubulaire incluant l'étape de distribution de l'adhésif, l'étape de l'application de l'adhésif et l'étape de l'adhésion du capuchon. Dans l'étape de distribution de l'adhésif, un adhésif est distribué selon une épaisseur uniforme sur une table circulaire. Dans l'étape d'application de l'adhésif, une face ouverte d'un capuchon cylindrique muni d'un dessous est pressée contre la table circulaire pour appliquer l'adhésif au capuchon. € l'étape de l'adhésion du capuchon, le capuchon enduit d'adhésif est fixé à un contenant. On présente aussi un appareil de fabrication d'emballage tubulaire.

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