C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 23/04 (2006.01) A61L 27/00 (2006.01) B29C 43/14 (2006.01) C08F 2/44 (2006.01) C08F 10/02 (2006.01)
Patent
CA 2114101
2114101 9303072 PCTABS00019 A homogeneous composite is provided comprising (a) about 0.5 to 90 % by weight of an ultrahigh molecular weight linear polyethylene having a molecular weight of at least about 400,000, a crystalline melting point of greater than 143 ·C, the reduction of said melting point upon remelting being at least 3 ·C, and a crystal morphology comprising a bimodal distribution of molecular chain fold spacings reflecting significant populations of both folded and very highly extended molecular chains, and (b) about 0.5 to 90 % by weight of at least one filler compound having a neutral-to-acidic surface, said polyethylene being polymerized onto the surface of said filler, and said composite being substantially free of polymer-free filler and of filler-free polymer. Also provided are processes for the preparation of such composites.
E. I. Du Pont de Nemours And Company
Sim & Mcburney
LandOfFree
Homogeneous high modulus ultrahigh molecular weight... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Homogeneous high modulus ultrahigh molecular weight..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Homogeneous high modulus ultrahigh molecular weight... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-2035834