Homogeneous low melting point copper based alloys

Details Homogeneous low melting point copper based alloys Homogeneous low melting point copper based alloys

C - Chemistry, Metallurgy

22

C

78/63, 75/1.1

C22C 9/02 (2006.01) B23K 35/02 (2006.01) B23K 35/30 (2006.01) C22C 45/00 (2006.01)

Patent

CA 1216441

ABSTRACT OF THE DISCLOSURE A copper based low melting point metal alloy composition consists essentially of about 2.5 to 11 atom percent tin, about 0 to 12 atom percent nickel and about 11 to 15 atom percent boron, the balance being essentially copper and incidental impurities. The composition is such that the total of copper and tin ranges from about 85 to 89 atom percent.

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