C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
400/5311
C09J 183/06 (2006.01) C09J 11/04 (2006.01) C09J 183/04 (2006.01)
Patent
CA 1339329
Hot-bonding silicone adhesive composition prepared by kneading and heating a mixture of a polydiorganosiloxane and a microparticulate silica and then adding an arbitrary amount of a solvent and an organopolysiloxane resin to the kneaded and heated mixture. The composition has substantially no tack at room temperature when freed of its solvent; however, it has high adhesive strength at elevated temperature.
604147
Dow Corning Toray Silicone Company Limited
Gowling Lafleur Henderson Llp
Toray Silicone Company Limited
LandOfFree
Hot-bonding silicone adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hot-bonding silicone adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot-bonding silicone adhesive composition will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1183694