Hot melt adhesive

Details Hot melt adhesive Hot melt adhesive

C - Chemistry, Metallurgy

08

L

400/1810, 400/46

C08L 31/00 (2006.01) B29C 61/06 (2006.01) C08L 77/00 (2006.01) C09J 123/08 (2006.01) C09J 177/00 (2006.01) H01B 3/30 (2006.01) H01B 3/44 (2006.01) H02G 15/18 (2006.01)

Patent

CA 1038992

ABSTRACT A hot melt adhesive composition comprising a compatible mixture of: a) an aridic ethylene co- ol terpolymer having an acid number ranging from about 3 to about 80, b) a polyamide having an amine number ranging from about 70 to about 400, and c) a minor effective amount of a tackifying agent; components a) and b) being present in a relative proportion by weight ranging from about 30:70 to 60:40. An encapsulation method utilizing said adhesive is also described.

181706

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