Hot-melt adhesive based on copolyamides, especially for the...

Details Hot-melt adhesive based on copolyamides, especially for the... Hot-melt adhesive based on copolyamides, especially for the...

C - Chemistry, Metallurgy

08

G

402/230

C08G 69/36 (2006.01) C08G 69/40 (2006.01)

Patent

CA 1065097

ABSTRACT OF THE DISCLOSURE: A hot-melt adhesive comprising co- polyamides obtained from (a) .epsilon.-caprolactam, (b) diamine salts of adipic acid, sebacic acid and/or azelaic acid and (c) alkylenedicarb- oxylic acid salts of polyether-diamines gives e.g. textile laminates which are particularly resistant to washing and dry-cleaning.

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