Hot-melt adhesive component layers for smart cards

Details Hot-melt adhesive component layers for smart cards Hot-melt adhesive component layers for smart cards

G - Physics

06

K

G06K 19/077 (2006.01) B29C 45/14 (2006.01) C09J 5/06 (2006.01)

Patent

CA 2347818

The invention relates to the utilization of thermoplastic hot melt adhesives for the production of component layers in smart cards or for the production of electronic transponders with the aid of a low pressure injection molding process at pressures ranging between 1 and 50 bar. Preferably, hot melt adhesives based on polyamide, polyurethane, polyester, atactic polypropylene, EVA copolymers or low molecular weight ethylene copolymers or the mixtures thereof are used in said method.

L'invention concerne l'utilisation d'adhésifs fusibles thermoplastiques pour la réalisation de couches constitutives de cartes intelligentes ou pour la production de transpondeurs électroniques selon un procédé de moulage par injection basse-pression, sous des pressions comprises entre 1 et 50 bar. On utilise, de préférence, pour la mise en oeuvre de ce procédé, des adhésifs fusibles à base de polyamide, de polyuréthanne, de polyester, de polypropylène atactique, de copolymères EVA ou de copolymères d'éthylène de faible poids moléculaire, ou bien à base de mélange de ceux-ci.

Affiliated with

Also associated with

Rating

Hot-melt adhesive component layers for smart cards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot-melt adhesive component layers for smart cards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot-melt adhesive component layers for smart cards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1995447