C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/1800, 400/30
C08K 3/32 (2006.01) C08L 23/04 (2006.01) C08L 33/06 (2006.01) C09J 133/08 (2006.01)
Patent
CA 1130029
TITLE Improved Hot Melt Adhesive Composition ABSTRACT Hot melt adhesive and sealant compositions based on alkali metal ionomers of random copolymers of ethylene, methyl acrylate, and one or more carboxylated monomers have improved high temperature viscosity stability when the composition contains 0.05-10 phr of ammonium polyphosphate.
351097
Boyce Richard J.
Cooper Terence A.
E. I. Du Pont de Nemours And Company
Mccallum Brooks & Co.
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