Hot melt adhesive composition

Details Hot melt adhesive composition Hot melt adhesive composition

C - Chemistry, Metallurgy

09

J

C09J 133/06 (2006.01) A61L 15/22 (2006.01) A61L 15/58 (2006.01) C09J 129/10 (2006.01) C09J 193/04 (2006.01) C09J 201/00 (2006.01)

Patent

CA 2175359

A hot melt adhesive composition is described which possesses properties which are desirable with respect to the construction of disposable articles. The adhesive composition includes about 10 to about 80 % by weight of as alkali soluble polymer; about 0 to about 30 % by weight of a poly[vinyl methyl ether]; about 30 to about 70 % by weight of a tackifying resin; and about 5 to about 30 %by weight of a suitable plasticizer.

On décrit une composition d'adhésif thermofusible possédant des propriétés qui sont très utiles pour des articles à uage unique. La composition adhésive contient environ 10 à environ 80 % en poids d'un polymère soluble en milieu alcalin; environ 0 à environ 30 % en poids d'un poly[vinylméthyléther]; environ 30 à 70 % en poids d'une résine augmentant la pégosité et environ 5 à environ 30 % en poids d'un plastifiant approprié.

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