Hot-melt adhesive composition

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

117/31, 400/4043

C09J 125/02 (2006.01) C09J 7/02 (2006.01) C09J 109/00 (2006.01) C09J 109/06 (2006.01) C09J 123/08 (2006.01) C09J 125/10 (2006.01) C09J 145/00 (2006.01) C09J 153/02 (2006.01)

Patent

CA 2035316

Disclosed is a hot-melt adhesive composition comprising (a) 20 to 70 parts by weight of a vinyl aromatic compound/conjugated diene copolymer or a hydrogenation product thereof, (b) 30 to 80 parts by weight of an alicyclic hydrocarbon resin tackifier, the total amount of the components (a) and (b) being 100 parts by weight, and (c) 0.3 to 20 parts by weight of a random copolymer of a cyclic olefin and ethylene.

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