Hot melt adhesive composition

Details Hot melt adhesive composition Hot melt adhesive composition

C - Chemistry, Metallurgy

09

J

C09J 123/08 (2006.01) B32B 7/12 (2006.01)

Patent

CA 2097303

Hot melt adhesive composition comprises an ethylene-C3-20 alpha-olefin copolymer of molecular weight 20,000-100,000 and comonomer content 6-30 weight percent and a tackifier. An isobutylene based liquid copolymer may additionally be in- corporated.

Affiliated with

Also associated with

Rating

Hot melt adhesive composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot melt adhesive composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot melt adhesive composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1772743