Hot-melt adhesive composition

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 125/16 (2006.01) C09J 101/00 (2006.01) C09J 125/02 (2006.01) C09J 145/00 (2006.01) C08L 53/02 (2006.01) C08L 101/00 (2006.01)

Patent

CA 2111493

Abstract A hot-melt adhesive composition containing, (A) per 10 to 80 parts by weight of a base polymer, (B) 10 to 80 parts by weight of a stickiness-imparting agent which is a copolymer of a particular styrene-type monomer and a particular indene-type monomer, the molar ratio of the indene-type monomer to the styrene-type monomer being from 99/1 to 30/70, and the weight average molecular weight of said copolymer being from 300 to 5000. The hot-melt adhesive composition exhibits excellent heat-resistant adhesiveness and heat-resistant creeping property, and has a low- molecular weight and exhibits good hue.

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