Hot melt adhesive composition and method

Details Hot melt adhesive composition and method Hot melt adhesive composition and method

C - Chemistry, Metallurgy

08

L

C08L 3/02 (2006.01) C08L 3/04 (2006.01) C09J 5/06 (2006.01) C09J 103/02 (2006.01) C09J 103/04 (2006.01)

Patent

CA 2089175

ABSTRACT HOT MELT ADHESIVE COMPOSITION AND METHOD A hot melt adhesive composition and method of use thereof is provided. The hot melt adhesive contains a major amount of a meltable saccharide, e.g. a lower alkyl glycoside and a minor amount of a polysaccharide derived from starch selected from the group consisting of pre-gelatinized converted starches, cold-water soluble dextrins, and maltodextrins, and mixtures of more than one of such members of said group. The amount of meltable saccharide is sufficient to provide a flowable melt of said composition and the degree of polymerization and said minor amount of the polysaccharide are sufficient to tackify said melt, but are insufficient to prevent said melt from flowing. Preferred compositions also contain a minor amount of dextrose in addition to an alkyl glycoside. The composition can be used alone as a hot melt or in admixture with other hot melt materials, e.g. ethylene/vinyl acetate copolymers. The composition is advantageously used to bond cellulosic substrates which are, as a result, particularly susceptible to repulping, and thus recycling.

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