Hot melt adhesive composition comprising homogeneous...

C - Chemistry – Metallurgy – 09 – J

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C09J 123/04 (2006.01) C09J 123/08 (2006.01) C09J 153/02 (2006.01) C08L 23/08 (2006.01) C08L 93/00 (2006.01)

Patent

CA 2336343

A hot melt adhesive composition comprising a) from about 5 wt.% to about 50 wt.% of at least one homogeneous linear or substantially linear ethylene/alpha- olefin interpolymer characterized as having a density from 0.850 to 0.965 g/cm3; b) from about 1 wt.% to about 40 wt.% of at least one block copolymer; and c) from about 10 wt.% to about 75 wt.% of at least one tackifying resin wherein said adhesive does not fail cohesively.

Composition adhésive thermofusible comprenant a) environ 5 % en poids à environ 50 % en poids d'au moins un interpolymère éthylène/alpha-oléfinique linéaire ou sensiblement linéaire homogène, caractérisée en ce que ce dernier présente une densité de 0,850 à 0,965 g/cm?3¿; et en ce qu'elle comprend en outre b) environ 1 % en poids à environ 40 % en poids d'au moins un copolymère séquencé; et c) environ 10 % en poids à environ 75 % en poids d'au moins une résine visqueuse, ledit adhésif conservant toujours sa cohésion.

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