Hot melt adhesive composition containing antimicrobial compound

Details Hot melt adhesive composition containing antimicrobial compound Hot melt adhesive composition containing antimicrobial compound

C - Chemistry, Metallurgy

09

J

C09J 11/00 (2006.01) A61B 19/08 (2006.01) A61F 13/02 (2006.01) A61L 15/46 (2006.01) A61L 15/58 (2006.01) C09J 11/06 (2006.01) C09J 133/08 (2006.01)

Patent

CA 2207641

An adhesive composition having dispersed therein a broad spectrum antimicrobial agent for use in medical applications, such as an adhesive for surgical drapes, wound dressings and tapes. The adhesive is composed of acrylic polymers, tackifiers and a preferred antimicrobial agent, diiodomethyl-p-tolylsulfone. The adhesive composition is essentially solventless and capable of application in a hot melt process while maintaining stability at elevated temperatures in the range of 275°F to 350°F, which not only allows hot melt application, but allows for ethylene oxide sterilization under heat stress.

Composition adhésive dans laquelle est dispersée un agent antimicrobien à large spectre pouvant être utilisé à des fins médicales, comme un adhésif pour les champs opératoires, les pansements et les rubans. L'adhésif est composé de polymères acryliques, d'agents collants et d'un agent antimicrobien de premier choix, le diiodométhyl-p-tolylsulfone. La composition adhésive est essentiellement sans solvant et peut être utilisée avec un applicateur d'adhésif thermofusible tout en demeurant stable à des températures élevées pouvant aller de 275 oF à 350 oF, ce qui permet non seulement une application d'adhésif à chaud mais également une stérilisation à l'oxyde d'éthylène sous contraintes thermiques.

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