Hot melt adhesives

Details Hot melt adhesives Hot melt adhesives

C - Chemistry, Metallurgy

08

L

400/1115, 400/18

C08L 53/00 (2006.01) C08L 7/00 (2006.01) C08L 101/00 (2006.01) C09J 7/02 (2006.01)

Patent

CA 1130947

ABSTRACT OF THE DISCLOSURE A two component hot melt, pressure-sensitive adhesive system is provided for producing a cure in an adhesive applied to a substrate by a hot melt technique; the system avoids premature curing of the adhesive and is especially useful for the manufacture of masking tape for high temperature applications.

284040

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