Hot melt adhesives based on ethylene-n-butyl acrylate

Details Hot melt adhesives based on ethylene-n-butyl acrylate Hot melt adhesives based on ethylene-n-butyl acrylate

C - Chemistry, Metallurgy

09

J

400/4044

C09J 123/08 (2006.01) C09J 133/08 (2006.01) C09J 165/00 (2006.01)

Patent

CA 1331817

ABSTRACT Hot melt packaging adhesive compositions consisting essentially of 35 to 450 by weight of an ethylene n-butyl acrylate copolymer containing 25 to 450 by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 50; 35 to 550 of a terpene phenolic tackifier; and 10 to 20% by weight of a high molting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability. These are used for cartons, trays and cases for packaging products at temperatures greater than about 40°C, which product may be stored at temperatures as low as about -18°C.

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