C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 153/02 (2006.01) A61L 15/22 (2006.01) A61L 15/58 (2006.01) C08F 297/04 (2006.01)
Patent
CA 2252756
Hot-melt adhesive compositions containing high molecular weight linear styrene- isoprene-styrene block copolymers or high molecular weight linear styrene-butadiene-styrene copolymers, having little or no residual diblock, and articles made therefrom. The resulting adhesive composition may include solid tackifying and liquid tackifying resins.
L'invention concerne des compositions d'adhésifs thermofusibles contenant des copolymères blocs linéaires de styrène-isoprène-styrène de faible masse molaire ou des copolymères linéaires de styrène-butadiène-styrène, comprenant une petite quantité de dibloc résiduel voir même aucun, ainsi que des articles fabriqués à partir desdites compositions. La composition adhésive résultante peut contenir des résines solides et liquides donnant du collant.
Diehl Charles F.
Tancrede Jean M.
Exxon Chemical Patents Inc.
Smart & Biggar
The Dow Chemical Company
Tsrc (usa) Investment Corporation
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