Hot melt adhesives having improved thermal stability

Details Hot melt adhesives having improved thermal stability Hot melt adhesives having improved thermal stability

C - Chemistry, Metallurgy

08

L

154/100, 400/762

C08L 67/04 (2006.01) C08K 3/36 (2006.01) C09J 167/04 (2006.01)

Patent

CA 1123133

ABSTRACT OF THE DISCLOSURE The thermal stability of hot melt adhesives comprising a polymer of glycolic acid is significantly improved by incorporating a minor amount of silica in the adhesive composition.

320416

Affiliated with

Also associated with

Rating

Hot melt adhesives having improved thermal stability does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot melt adhesives having improved thermal stability, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot melt adhesives having improved thermal stability will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-659461