Hot melt adhesives of improved melt viscosity stability

Details Hot melt adhesives of improved melt viscosity stability Hot melt adhesives of improved melt viscosity stability

C - Chemistry, Metallurgy

08

L

400/1709, 400/18

C08L 23/16 (2006.01) C08K 3/38 (2006.01) C08K 5/55 (2006.01) C08L 91/08 (2006.01) C08L 93/04 (2006.01) C09J 123/16 (2006.01) C09J 157/02 (2006.01) C09J 191/08 (2006.01)

Patent

CA 1050675

ABSTRACT OF THE DISCLOSURE The viscosity stability of hot melt adhesives containing an elastomeric linear EPDM, branched ethylene/ propylene copolymer, or propylene/hexene-1 dipolymer is markedly improved by inclusion in the adhesive comp- sition of boric acid, boric anhydride, or oric acid ester, in combination with a phenolic antioxidant.

196504

Affiliated with

Also associated with

Rating

Hot melt adhesives of improved melt viscosity stability does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Hot melt adhesives of improved melt viscosity stability, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hot melt adhesives of improved melt viscosity stability will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-134543