Hot-melt adhesives with copolymer base having epoxy functions

Details Hot-melt adhesives with copolymer base having epoxy functions Hot-melt adhesives with copolymer base having epoxy functions

C - Chemistry, Metallurgy

09

J

C09J 123/08 (2006.01)

Patent

CA 2244972

The invention concerns a hot-melt adhesive with a base of a copolymer (A) comprising the following units: ethylene, optionally a monomer selected among vinyl esters or alkyl (meth) acrylate, at least an unsaturate epoxy. It can be formularized with a tackifying resin and a wax. Ethylene copolymers, n-butyl acrylate and glycidyl methacrylate are advantageously used.

La présente invention concerne une colle thermofusible à base d'un copolymère (A) comprenant des motifs: éthylène, éventuellement un monomère choisi parmi les esters vinyliques et les (méth)acrylates d'alkyle, au moins un époxyde insaturé. Elle peut être formulée avec une résine tackifiante et une cire. On utilise avantageusement des copolymères de l'éthylène, de l'acrylate de n- butyle et du méthacrylate de glycidyle.

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