Hot-melt compositions based on ethylene/methyl acrylate...

Details Hot-melt compositions based on ethylene/methyl acrylate... Hot-melt compositions based on ethylene/methyl acrylate...

C - Chemistry, Metallurgy

08

L

C08L 33/02 (2006.01) C08L 45/00 (2006.01) C08L 93/04 (2006.01) C09J 5/00 (2006.01) C09J 123/08 (2006.01)

Patent

CA 2082540

47328CAN6A HOT-MELT COMPOSITIONS BASED ON ETHYLENE/METHYL COPOLYMERS WHICH HAVE GOOD OPEN TIME, FORM CREEP-RESISTANT BONDS, AND DEMONSTRATE STRENGTH AT ELEVATED TEMPERATURES WHEN APPLIED IN THIN LAYERS Abstract of the Disclosure A hot-melt composition consists essentially of an ethylene/methyl acrylate copolymer and a tackifying resin. When deposited on an unheated substrate in a thin layer, the composition has a limited open time of at least 5 seconds, a creep resistance of 10,000 minutes, and an elevated temperature strength of at least 1,000 minutes.

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