Hot melt conductor paste composition

H - Electricity – 01 – B

Patent

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Details

H01B 1/00 (2006.01) B05D 5/12 (2006.01) C09D 5/24 (2006.01) H01B 1/02 (2006.01) H01B 1/22 (2006.01) H01B 13/00 (2006.01) H01L 31/18 (2006.01)

Patent

CA 2467690

The present invention provides a hot melt conductor paste composition that includes conductive particles and glass particles dispersed in a thermoplastic polymer system. The hot melt conductor paste composition according to the invention is a solid at room temperature, but melts at a temperature of from about 35~C to about 90~C to form a flowable liquid that can be applied to a silicon substrate by screen printing. The hot melt conductor paste composition is particularly suitable for use in the fabrication of photovoltaic cells.

La présente invention concerne une composition de colle thermofusible électroconductrice faite de particules électroconductrices et de particules de verre en dispersion dans un système polymère thermoplastique. Cette composition de colle thermofusible électroconductrice est à l'état solide à température ambiante, mais elle fond à une température se situant dans la plage des 35 ·C à 90 ·C, formant ainsi un liquide fluide pouvant s'appliquer en sérigraphie sur un substrat de silicium. La composition de colle thermofusible électroconductrice de l'invention convient particulièrement pour la fabrication de piles photovoltaïques.

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