Hot melt dispenser body

B - Operations – Transporting – 05 – C

Patent

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B05C 5/02 (2006.01) B05C 17/005 (2006.01) B29B 13/02 (2006.01)

Patent

CA 1090558

Abstract of the Disclosure A hot melt for an applicator or dispenser of thermoplastic adhesive first received in solid form, either as a progressively fed rod or in another mode, is provided having especial advantage in alight-weight band-type device. The main melt chamber and its auxiliary channels as well as their interconnecting passageways are of configuration and spacing to effect maximum efficiency in transferring melting heat from a heating means to the adhesive being liquefied. To this end, also, complemental portions of the body include passageways designed to provide minimum, substantially uniform resistance to advance of the solid adhesive along the length of the melt body.

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