Hot-melt pressure sensitive adhesive

Details Hot-melt pressure sensitive adhesive Hot-melt pressure sensitive adhesive

C - Chemistry, Metallurgy

08

L

400/3032

C08L 53/00 (2006.01) C08K 5/01 (2006.01) C09J 3/14 (1980.01) C09J 3/26 (1980.01)

Patent

CA 1083745

ABSTRACT OF THE DISCLOSURE A hot-melt pressure sensitive adhesive, pourable at 150-200°C, comprises 10-30% by weight of a rubbery copolymer; 15-40% by weight of a naphthenic or paraffinic oil, or a mixture thereof, having an initial boiling point above 200°C; and 40-65% by weight of a terpene tackifier resin. The rubbery copolymer may be a teleblock copolymer comprising molecules having at least three branches radially branching out from a central hub, each branch having polystyrene terminal blocks and a butadiene segment in the center; or a three-block A-B-A block copolymer, the A blocks being polystyrene and the B block being a rubbery ethylene- butylene polymer; or a mixture thereof. The adhesive has an advantageous combination of properties for use in adhesive-coated absorbent articles, such as sanitary napkins.

328574

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